💡 The toughest complex engineering challenges rarely fit neatly into a single discipline. Mechatronics, optomechatronics, robotics, optics & vision, and data-driven engineering – the breakthroughs that matter most happen at the intersection of all of them, applied to markets like Life Sciences & Health and High-Tech Systems & Materials. That’s exactly where Demcon has been operating for more than 30 years. We’re excited to welcome Demcon as a 2026 Hello Tomorrow Summit partner! 🎉 With a global presence across the Netherlands, Germany, Japan, Singapore, and the U.S., Demcon develops, manufactures, and delivers complex high-tech systems for markets including Life Sciences & Health, High-Tech Systems, Energy, Defense & Security, Water & Maritime, and Smart Industry – from early concept through industrialization and serial production: 🔸 End-to-end engineering: proof of principle and prototyping through industrialization and series production 🔸 Deep, in-house expertise in mechatronics, optomechatronics, robotics, optics & vision, and data science & machine learning – built over decades 🔸 Active investment in startups and spin-offs, including recent expansion into biotech, simulation technology, and molten salt reactors Are you a founder or team navigating the path from lab prototype to a market-ready product? 👉 Meet Demcon at the 2026 Hello Tomorrow Summit, June 11–12 in Amsterdam. 🎟️ Ticket link in the comments #DeepTech #HelloTomorrow2026 #TechForGood
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On 25 June 2026, TracXon will unveil a machine that transforms Flexible Hybrid Electronics into a serious and sustainable alternative to traditional PCB technologies. Don't miss it!
𝗬𝗼𝘂 𝗱𝗼𝗻’𝘁 𝗯𝘂𝗶𝗹𝗱 𝘁𝗵𝗲 𝗺𝗮𝗰𝗵𝗶𝗻𝗲 𝘂𝗻𝘁𝗶𝗹 𝘆𝗼𝘂’𝘃𝗲 𝗺𝗮𝘀𝘁𝗲𝗿𝗲𝗱 𝘁𝗵𝗲 𝗽𝗿𝗼𝗰𝗲𝘀𝘀. 𝗢𝗻 𝟮𝟱 𝗝𝘂𝗻𝗲 𝟮𝟬𝟮𝟲, TracXon opens its doors in Eindhoven for an exclusive Demo Day. This is where we unveil something the industry has been missing: 𝘁𝗵𝗲 𝗶𝗻𝗱𝘂𝘀𝘁𝗿𝘆'𝘀 𝗳𝗶𝗿𝘀𝘁 𝗥𝗼𝗹𝗹-𝘁𝗼-𝗥𝗼𝗹𝗹 𝗩𝗜𝗔 𝗺𝗮𝗰𝗵𝗶𝗻𝗲. 𝗔 𝗺𝗶𝗹𝗲𝘀𝘁𝗼𝗻𝗲 𝗻𝗼𝘁 𝗷𝘂𝘀𝘁 𝗳𝗼𝗿 𝗧𝗿𝗮𝗰𝗫𝗼𝗻 — 𝗯𝘂𝘁 𝗳𝗼𝗿 𝘁𝗵𝗲 𝗶𝗻𝗱𝘂𝘀𝘁𝗿𝗶𝗮𝗹𝗶𝘇𝗮𝘁𝗶𝗼𝗻 𝗼𝗳 𝗙𝗹𝗲𝘅𝗶𝗯𝗹𝗲 𝗛𝘆𝗯𝗿𝗶𝗱 𝗘𝗹𝗲𝗰𝘁𝗿𝗼𝗻𝗶𝗰𝘀. What to expect: - A live prototype demonstration of the R2R VIA process - Deep-dive sessions with our engineers and technology experts - Conversations with industry leaders, investors, and partners shaping the future of advanced manufacturing This is more than a demo. It’s a glimpse into how innovation becomes scalable reality. 📍 𝗛𝗮𝘀𝘁𝗲𝗹𝘄𝗲𝗴 𝟮𝟮𝟮, 𝗘𝗶𝗻𝗱𝗵𝗼𝘃𝗲𝗻 Two sessions (same program, please only register for one): 𝗚𝗿𝗼𝘂𝗽 𝟭 | 𝟭𝟬:𝟬𝟬–𝟭𝟯:𝟬𝟬 https://lnkd.in/dDGvCb4Q 𝗚𝗿𝗼𝘂𝗽 𝟮 | 𝟭𝟱:𝟬𝟬–𝟭𝟴:𝟬𝟬 https://lnkd.in/dKea8KKe Please register for one session only. Curious to see what’s next for electronics manufacturing? Join us on June 25. #PrintedElectronics #FlexibleHybridElectronics #HybridPrintedElectronics #AdvancedManufacturing #DeepTech #RollToRoll #R2R #SustainableElectronics #ManufacturingInnovation
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This is an excellent example of the strength of #BrainportEindhoven, making equipment for the semicon / electronics industry. Now TracXon will show and demo industry's first Roll-to-Roll VIA Machine, a milestone for the industrialization of Flexible Hybrid Electronics. See the invite below. #proudtobeeuropean #equipment
𝗬𝗼𝘂 𝗱𝗼𝗻’𝘁 𝗯𝘂𝗶𝗹𝗱 𝘁𝗵𝗲 𝗺𝗮𝗰𝗵𝗶𝗻𝗲 𝘂𝗻𝘁𝗶𝗹 𝘆𝗼𝘂’𝘃𝗲 𝗺𝗮𝘀𝘁𝗲𝗿𝗲𝗱 𝘁𝗵𝗲 𝗽𝗿𝗼𝗰𝗲𝘀𝘀. 𝗢𝗻 𝟮𝟱 𝗝𝘂𝗻𝗲 𝟮𝟬𝟮𝟲, TracXon opens its doors in Eindhoven for an exclusive Demo Day. This is where we unveil something the industry has been missing: 𝘁𝗵𝗲 𝗶𝗻𝗱𝘂𝘀𝘁𝗿𝘆'𝘀 𝗳𝗶𝗿𝘀𝘁 𝗥𝗼𝗹𝗹-𝘁𝗼-𝗥𝗼𝗹𝗹 𝗩𝗜𝗔 𝗺𝗮𝗰𝗵𝗶𝗻𝗲. 𝗔 𝗺𝗶𝗹𝗲𝘀𝘁𝗼𝗻𝗲 𝗻𝗼𝘁 𝗷𝘂𝘀𝘁 𝗳𝗼𝗿 𝗧𝗿𝗮𝗰𝗫𝗼𝗻 — 𝗯𝘂𝘁 𝗳𝗼𝗿 𝘁𝗵𝗲 𝗶𝗻𝗱𝘂𝘀𝘁𝗿𝗶𝗮𝗹𝗶𝘇𝗮𝘁𝗶𝗼𝗻 𝗼𝗳 𝗙𝗹𝗲𝘅𝗶𝗯𝗹𝗲 𝗛𝘆𝗯𝗿𝗶𝗱 𝗘𝗹𝗲𝗰𝘁𝗿𝗼𝗻𝗶𝗰𝘀. What to expect: - A live prototype demonstration of the R2R VIA process - Deep-dive sessions with our engineers and technology experts - Conversations with industry leaders, investors, and partners shaping the future of advanced manufacturing This is more than a demo. It’s a glimpse into how innovation becomes scalable reality. 📍 𝗛𝗮𝘀𝘁𝗲𝗹𝘄𝗲𝗴 𝟮𝟮𝟮, 𝗘𝗶𝗻𝗱𝗵𝗼𝘃𝗲𝗻 Two sessions (same program, please only register for one): 𝗚𝗿𝗼𝘂𝗽 𝟭 | 𝟭𝟬:𝟬𝟬–𝟭𝟯:𝟬𝟬 https://lnkd.in/dDGvCb4Q 𝗚𝗿𝗼𝘂𝗽 𝟮 | 𝟭𝟱:𝟬𝟬–𝟭𝟴:𝟬𝟬 https://lnkd.in/dKea8KKe Please register for one session only. Curious to see what’s next for electronics manufacturing? Join us on June 25. #PrintedElectronics #FlexibleHybridElectronics #HybridPrintedElectronics #AdvancedManufacturing #DeepTech #RollToRoll #R2R #SustainableElectronics #ManufacturingInnovation
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Swiss Photonics Integration Center (Swiss PIC)'s mission is to bridge photonic innovation to market ready modules, providing #advanced #packaging and integration services from first concept to scalable product. Join us for next week's Swissphotonics lunch chat by Andreas Hugi, CEO of Swiss PIC who will show how Swiss PIC supports customers 𝐟𝐫𝐨𝐦 𝐞𝐚𝐫𝐥𝐲 𝐩𝐚𝐜𝐤𝐚𝐠𝐢𝐧𝐠 𝐞𝐧𝐠𝐢𝐧𝐞𝐞𝐫𝐢𝐧𝐠 𝐭𝐡𝐫𝐨𝐮𝐠𝐡 𝐩𝐢𝐥𝐨𝐭 𝐚𝐧𝐝 𝐬𝐦𝐚𝐥𝐥 𝐬𝐞𝐫𝐢𝐞𝐬 𝐩𝐫𝐨𝐝𝐮𝐜𝐭𝐢𝐨𝐧, combining agile engineering with production grade infrastructure and industrial processes in an ISO 6 cleanroom. He will introduce Swiss PIC’s newest test and characterization capabilities 𝐮𝐩 𝐭𝐨 145 𝐆𝐇𝐳 supporting the evaluation of high bandwidth photonic modules. Furthermore, he will describe 𝐚 𝐬𝐭𝐚𝐧𝐝𝐚𝐫𝐝𝐢𝐳𝐞𝐝 𝐑𝐅 𝐞𝐯𝐚𝐥𝐮𝐚𝐭𝐢𝐨𝐧 𝐛𝐨𝐚𝐫𝐝 𝐫𝐞𝐚𝐜𝐡𝐢𝐧𝐠 100 𝐆𝐇𝐳 (-3 𝐝𝐁), enabling fast turnaround characterization and forming a robust basis for industrialized high-bandwidth photonic modules, see https://lnkd.in/eWahAB_g . Swissphotonics Swiss Photonics Integration Center (Swiss PIC) #PICs #high-#frequency
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📊 How deeptech is already revolutionising EV powertrain engineering -Article by Simon Shepherd, Head of eDrive and Chief Product Officer, Monumo Deeptech is transforming EV powertrain engineering by introducing new levels of computational freedom, speed, and system integration, allowing companies to achieve levels of performance and cost reduction previously out of reach through existing methods. Nature-Inspired System Design Modern engineering increasingly draws inspiration from nature, where efficiency is achieved through adaptation and system-level harmony. EV developers are now using advanced computational tools to explore organic, highly optimised component shapes and system architectures; mirroring, for example, how a tree or a bird’s wing achieves a perfect balance of forces. Unlike natural evolution, which takes millennia, digital tools allow engineers to iterate and converge on superior solutions within weeks, critical for keeping pace with rapidly changing industry and regulatory demands. ▶️ Continue reading the full article: https://lnkd.in/de2NdUnh #CTI_Sym #CTISymposium
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#Itilians Bart Thiesen and Jonathan Kaijser joined #PICInternational 2026 #Itilians Bart & Jonathan joined PIC Magazine & PIC International Conference 2026, together with #SMARTPhotonics. Great to be connecting with players across the international photonics ecosystem. Bart also took the stage with his session 'Building the Fab of the Future', focused on scaling photonic integrated circuit manufacturing from R&D to high-volume production. One key takeaway: scaling PIC manufacturing is not only about advanced technology. It also depends on strong digital foundations, connected manufacturing processes, data-driven decision-making, and collaboration across the ecosystem. Cool to bring in our experience from the semicon industry, combined with automation, data, and AI to strengthen the core processes around design, manufacturing, and testing. Plenty of exciting work ahead as the photonics industry continues to mature and scale.
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Today, I had the pleasure of hosting Laura Klitgaard , Chair of IDA, and Carl Aage Dahl , Managing Director of IDA, at ATLANT 3D in Taastrup. We had an inspiring discussion about the future of advanced manufacturing, materials innovation, microelectronics, and the role Denmark and Europe can play in building the next generation of deep tech companies. A key part of the conversation was also how technologies like ours can help train a new generation of engineers — engineers who will work with advanced digital, AI-driven innovation and manufacturing platforms to create new materials, new devices, and ultimately establish new industries. At ATLANT 3D, we are working to make atomic-scale manufacturing more accessible, scalable, and programmable. Our vision is to enable researchers, engineers, and innovators to move faster from idea to material, from material to device, and from device to industrial application. This requires more than technology alone. It requires education, talent development, strong industrial ecosystems, and close collaboration between companies, universities, investors, policymakers, and organizations like IDA. Thank you, Laura and Carl, for visiting us today and for an inspiring conversation about how Denmark and Europe can support breakthrough technologies, develop future engineering talent, and build globally competitive deep tech industries. #ATLANT3D #IDA #DeepTech #AdvancedManufacturing #Microelectronics #EngineeringTalent #AI #DigitalManufacturing #MaterialsInnovation #AtomicScaleManufacturing #Denmark #Europe
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Our #ManufacturingUSA network has been busy this May! Catch up on the highlights in our latest newsletter: https://lnks.gd/3/3VJb3rT 🔵 The National Academies of Sciences, Engineering, and Medicine report released 🔵 AIM Photonics welcomed a new director 🔵 ARM Institute to host free robotics webinar 🔵 MxD, PowerAmerica, & NextFlex participated in American Association of Community Colleges Annual Conference 🔵 America Makes announced project calls totaling $25M 🔵 REMADE Institute® offers free circular economy publications Get these updates straight to your inbox: https://lnkd.in/edKc4SyW
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🔍 Why the gap between lab and production is getting wider I came across a very interesting article recently that puts words on something many of us see every day in advanced packaging: 👉 the growing gap between what works in the lab… and what actually works in production. And it’s not a marginal issue — it’s becoming structural. 📌 Key takeaways: ➡️Materials no longer behave the same once integrated into complex systems ➡️Failures increasingly come from interactions between materials, not from the materials themselves ➡️Simulation models struggle to capture real production conditions ➡️And the most accurate data… is often the least accessible In short, what passes in development can still fail in production 💡 As advanced packaging becomes more complex (heterogeneous integration, chiplets, multi-material stacks), this gap is only getting wider. And this is exactly where the challenge lies today: turning innovation into something that actually works — reliably — at scale. At Finetech, this is where we come in. 👉By providing flexible and modular bonding platforms, we help bridge this gap 👉Enabling customized assembly processes adapted to real production constraints 👉And accelerating the transition from R&D to industrialization 📖 Worth a read if you’re working on advanced packaging or facing scale-up challenges. #AdvancedPackaging #Semiconductors #Microelectronics #Bonding
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📢 Innovatrix is delighted to share that ELEMENT 3-5 GmbH will be joining us as a Lunch Sponsor of our upcoming event, the 4th Constructing Semiconductor FAB Summit Europe: Advances in Planning, Design and Engineering. 📅 October 21-22, 2026 📍 Munich, Germany ELEMENT 3-5 GmbH is a technology source for the semiconductor industry. The product spectrum ranges from production systems based on the novel low-temperature epitaxy to ion and plasma sources for a wide variety of applications in semiconductor technology. With the ACCELERATOR 3500K, the company currently supplies the most powerful epitaxy system for the production of monocrystalline aluminium nitride templates. To join us in Munich this October for the chance to hear presentations from industry experts, connect with solution providers and expand your network, click https://lnkd.in/dvdfhpHm for event information or contact info@innovatrix.eu for a full agenda of the event. #Element35 #Innovatrix #FABSummitEU #FabSummitEurope #Munich #Semiconductor #FabConstruction #Cleanroom #ModularConstruction #SemiconductorFoundry #ChipDesign #AI #SemiFab
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𝙎𝙞𝙡𝙚𝙣𝙩 𝘿𝙞𝙨𝙧𝙪𝙥𝙩𝙞𝙤𝙣 𝙞𝙣 𝙩𝙝𝙚 𝙊𝙥𝙩𝙞𝙘𝙖𝙡 𝘿𝙚𝙨𝙞𝙜𝙣 𝙎𝙤𝙡𝙪𝙩𝙞𝙤𝙣𝙨 𝙈𝙖𝙧𝙠𝙚𝙩: 𝙍𝙚𝙨𝙝𝙖𝙥𝙞𝙣𝙜 𝙎𝙪𝙥𝙥𝙡𝙮 𝘾𝙝𝙖𝙞𝙣𝙨 𝙛𝙧𝙤𝙢 𝙩𝙝𝙚 𝙂𝙧𝙤𝙪𝙣𝙙 𝙐𝙥 Optical Design Solutions Market is evolving as a critical segment within photonics and engineering software, enabling precise modeling, simulation, and optimization of advanced optical systems used in aerospace, healthcare, automotive, and consumer electronics. Increasing demand for high-performance imaging systems, LiDAR technologies, and miniaturized optical components is accelerating adoption across industries. Rising integration of AI-driven simulation tools, cloud-based optical engineering platforms, and freeform lens design capabilities is a major growth driver. 🆅🅸🆂🅸🆃 🆄🆂:- https://lnkd.in/gSzgSm-c Continuous innovation in multiphysics simulation, GPU-accelerated ray tracing, and digital twin-based optical validation is enhancing design accuracy and reducing prototyping costs significantly. Recent developments include the launch of AI-enhanced optical simulation engines, GPU-accelerated ray-tracing updates, and integrated photonics design workflows that combine mechanical and optical modeling. Companies are increasingly investing in cloud-native platforms and collaborative design ecosystems to improve efficiency and reduce product development cycles. 𝑻𝒐𝒑 𝑲𝒆𝒚 𝑷𝒍𝒂𝒚𝒆𝒓𝒔: Food Processing Technologies | Netracon Technologies (Pvt.) Ltd. | WIN Technology | Chemspeed | Sivers Semiconductors | StellarNet, Inc. | MAF RODA AGROBOTIC | Corephotonics Ltd | Azista Space | Adaptive Recognition | Mikros Technologies | Polycab Telecom | VLC Photonics (Hitachi Group) | Johanson Technology, Inc. | Glow Networks | Hue Lens Colorboost | OpenLight | Leica Portugal | SATLANTIS | Orbotech | FOSS | Mitutoyo Europe | HORIBA for Materials | Buyutech | CIMBRIA | Univet Optical Technologies | HQ Pack | AndersDX | Optilan | MBRYONICS | Atlas Copco Group | The Monarch Enterprises | STS Defence | Accton | Voyis | SMP Engineering Inc | Nahj Technology LLC | VIA optronics | ATX Networks Corp. #OpticalDesign #Photonics #OpticalEngineering #SimulationSoftware #ARVRTechnology
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Proud to be a partner and very much looking forward to meeting everyone at the summit. Don't forget to stop by and say hello! 👀💙