Striker® makes the starting lineup. ⚾ This ALD roster is built to handle every position on the field, where precision layering decides the outcome. Learn more about it. https://bit.ly/49FmoIE
Lam Research
Semiconductor Manufacturing
Fremont, CA 464,048 followers
Driving semiconductor breakthroughs that define the next generation. Trusted partner of the world’s leading chipmakers.
About us
Lam Research Corp. (NASDAQ:LRCX) At Lam Research, we create equipment that drives technological advancements in the semiconductor industry. Our innovative solutions enable chipmakers to power progress in nearly all aspects of modern life, and it takes each member of our team to make it possible. Across our organization, our employees come to work and change the world. We take on the toughest challenges with precision and accuracy. We push for the next big semiconductor breakthrough. We lead the way in one of the most critical and fast-moving industries on the planet. And we do it together, with deep connections and limitless collaboration. The impact we have on the world is made possible by focusing on our people. We recognize and celebrate our teams’ achievements. We strive to create an inclusive and diverse culture where everyone’s contribution and voice has value. We evaluate and evolve our offerings, so our people receive the support and empowerment to do meaningful things for their lives, careers, and communities. Because at Lam, we believe that when people are the priority and they’re inspired to unleash the power of innovation for a better world together, anything is possible. Ready to help define the future of technology? Join us: www.lamresearch.com/careers
- Website
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http://www.lamresearch.com
External link for Lam Research
- Industry
- Semiconductor Manufacturing
- Company size
- 10,001+ employees
- Headquarters
- Fremont, CA
- Type
- Public Company
- Founded
- 1980
- Specialties
- Semiconductor Manufacturing Equipment, Global Services, Fabrication Technology, Chipmaker Solutions, Microprocessors, and Wafer Processing
Locations
Employees at Lam Research
Updates
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Backside power delivery networks (BSPDNs) improve power integrity and relieve frontside routing congestion — but they also introduce new fabrication and mechanical stress challenges at the transistor level. The Semiverse® Solutions team studied how different integration schemes affect channel stress and nanosheet displacement in GAA transistors. The blog has more. https://bit.ly/4wQKwSK
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Pattern-dependent etch variation creates different outcomes across the same chip — even under the same process conditions. Our Semiverse® Solutions team explores how dummy fill and SEMulator3D® simulation improve STI recess uniformity and help engineers evaluate layout tradeoffs faster. Take a look at the study. https://bit.ly/4wCHyRt
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AI raises the stakes for equipment suppliers. As the industry faces scaling challenges and tight development cycles, our goal is clear: help customers succeed in the AI era, and do so with velocity. This means delivering game-changing technologies that enable the world’s most advanced chips, building facilities designed to scale without disruption, enabling the autonomous fab, and bringing innovation closer to customers. Read more. https://bit.ly/4uJYWC7
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With the push toward sub-2nm nodes, interconnects introduce both challenges and opportunities. By combining process modeling and wafer data, we identified how spacer thickness, Ru etch angle, and litho bias impact resistance and capacitance variability in an 18nm metal pitch semi-damascene flow. Explore the findings. https://bit.ly/3CIBOhD
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Time to step back into 2010! Global semiconductor sales reached ~$300B, driving rapid demand for advanced technology. That same year, we introduced the SABRE® 3D ECD system to advance wafer-level packaging and enable more precise, scalable device integration for increasingly complex chip architectures.
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“We are in the era where packaging is as important to continued scaling as everything else,” said EVP/COO Sesha Varadarajan. This shift shows up fast in panel-level packaging, where AI and HPC demand larger, more complex packages than traditional wafer-based approaches can efficiently support. Moving to panels creates new opportunities but also new challenges in glass integration, warpage, materials performance, and hybrid bonding. The next phase of scaling depends on getting packaging right. Learn more via Semiconductor Engineering. https://bit.ly/3QvBWYL
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DRAM scaling gets more complex as AI accelerates demand. 📈 We connect the critical pieces of advanced manufacturing, bringing together etch, deposition, patterning, automation, and AI-enabled optimization to help customers move from constraint to capacity faster. Each of our solutions plays its part in building a more complete, efficient path to production readiness. The blog post shares more. https://bit.ly/4cL24GE