Innolume GmbH

𝐈𝐧𝐧𝐨𝐥𝐮𝐦𝐞 𝐬𝐢𝐠𝐧𝐬 𝐜𝐨𝐨𝐩𝐞𝐫𝐚𝐭𝐢𝐨𝐧 𝐚𝐠𝐫𝐞𝐞𝐦𝐞𝐧𝐭 𝐰𝐢𝐭𝐡 𝐂𝐚𝐧𝐚𝐝𝐚’𝐬 𝐂𝐏𝐅𝐂 Innolume is pleased to announce the signing of its first strategic cooperation agreement with the Canadian Photonics Fabrication Centre (CPFC), a Canadian centre specializing in the fabrication of photonic components based on III-V semiconductor technologies. This agreement marks the beginning of a long-term collaboration focused on photonics and the development of advanced optical technologies. The partnership comes at an important stage in CPFC’s further development as an independent commercial entity. More about the Canadian Photonics Fabrication Centre: https://lnkd.in/etMTqnWS  

Alexey Kovsh to speak at CHIPS NORTH 2026   Alexey Kovsh will join industry leaders Chuck Mattera (founder of Avalanche Thinking and former Chair and CEO of Coherent Corp), Joe Costello (veteran tech executive and CEO of InPho), and Velko Tzolov (General Manager at the Canadian Photonics Fabrication Centre) for the opening session of the CHIPS NORTH 2026 Main Summit. The session, titled "Optocomputing: Beyond Silicon - From Electrons to Photons," will take place on May 5, 2026, at the Brookstreet Hotel in Ottawa.   The event will focus on the transition from electronic to photonic technologies in computing. As the demand for higher performance and energy efficiency intensifies, photonic solutions are emerging as critical alternatives to traditional electronic architectures. CHIPS NORTH is an annual forum that unites semiconductor industry leaders, government officials, and technology experts to address evolving challenges and shape the future of AI systems and next-generation computing platforms. Alexey will present our vision of when and how optical interconnects will begin to penetrate to scale-up networks within AI data center networks. He will also highlight a potential role of DFB lasers, comb-lasers, and WDM SOAs based on GaAs Quantum Dots. 🔗Register here: https://lnkd.in/gBWfjqST 🔗Explore the full program: https://lnkd.in/evR3_N6n #CHIPSNORTH #CanadaSemiconductor #Optocomputing

𝐎𝐮𝐫 𝐜𝐨𝐦𝐛 𝐩𝐚𝐩𝐞𝐫 𝐢𝐬 𝐩𝐮𝐛𝐥𝐢𝐬𝐡𝐞𝐝 𝐢𝐧 𝐒𝐜𝐢𝐞𝐧𝐭𝐢𝐟𝐢𝐜 𝐑𝐞𝐩𝐨𝐫𝐭𝐬 We are happy to share that our paper “O-band DWDM data transmission with quantum dot mode-locked comb laser and semiconductor optical amplifier” https://lnkd.in/dU4vVYSS has been published in the Scientific Reports, part of the Nature Portfolio. It is based on recent developments at Innolume, including a quantum dot (QD)-based broadband 100 GHz mode-locked comb laser and QD-based low noise WDM semiconductor optical amplifier (SOA). This study addresses a long-standing challenge of increasing data transmission rates in the O-band while meeting the power requirements needed to overcome losses in a PIC. We use a single comb laser chip emitting multiple low-noise spectral modes and simultaneously re-amplify 23 comb lines, depleted after the PIC, using a low-noise SOA. In this way, we demonstrate O-band DWDM data transmission of a PAM4 signal with a total bit rate of up to 2.3 Tb/s in fiber using a single QD comb laser source. This study also reports ongoing advances at Innolume in the development of single-cavity comb lasers with increased interline separation, which is important for compatibility with state-of-the-art DWDM PIC technologies. We present comb laser devices with and without a saturable absorber section, providing up to 10 lines with 138 GHz spacing, 4 lines with 163 GHz spacing, and 3 lines with 216 GHz spacing, suitable for data transmission.

OFC 2026 - what a week! This year’s show and conference confirmed one thing: the industry is actively rethinking laser and amplifier platforms for next-generation optical interconnects, and quantum dot (QD) GaAs is moving into the spotlight. At our booth, we presented a strong and application-driven portfolio: 🔹 High-power DFB lasers from 70 mW up to 600 mW targeting 1.6T transceivers, CPO and ELSFP architectures. 🔹 New results on broadband SOAs covering full CWDM bands. 🔹 Continued advancements in COMB lasers and custom QD-based developments. We also saw clear market signals: 1. Growing concern around InP scalability and supply. 2. Increasing attention to GaAs QD as a viable alternative platform. 3. Strong engagement from both established hyperscalers and module manufactures as well as  emerging players. Our meeting schedule was fully packed and the number of qualified leads is likely the highest we’ve ever recorded at OFC. Beyond our own booth, it was especially exciting to see how widely QD technology is being adopted across the ecosystem: 🔹 High-power QD DFB lasers demonstrated by Aperion in ELSFP pluggables, showing near-athermal behavior (stable output while cycling 40–60°C), operating at up to 23 dBm (200 mW) across four O-band wavelengths with 10 nm spacing. 🔹 Lightmatter presented a QD SOA-enabled DWDM CPO link achieving up to 9 dB link margin gain with only ~2 dB penalty. 🔹 Ayar Labs ran a live demo with Innolume DFB-based ELS operating continuously for 3 days without spectral drift. 🔹 Solinide showcased a micro-comb source based on QD GaAs DFB + SOA, generating multiple modes with 200 GHz spacing. 🔹 Yokogawa demonstrated a comb laser running continuously with ~75 dB SMSR. …and many more examples across the show floor. As also highlighted in Jose Pozo’s OFC 2026 interviews https://lnkd.in/d9KgarrY , the industry is shifting from component-level optimization to system-level design driven by cooling, density, and standardization. Further analysis is available in a research note by LightCounting Market Research (access limited to subscribers) https://lnkd.in/djePkggW providing additional perspective on these trends, including QD lasers. For us, this OFC was not just about products, it was about validation. Validation that QD GaAs (DFB, SOA, comb) is becoming a platform for high-speed pluggable optics, co-packaged optics (CPO), energy-efficient, scalable interconnects. Most importantly, it was a great opportunity to reconnect with friends, partners, and customers, and to start new conversations that will shape the next generation of optical systems. Thank you to everyone who stopped by.

Innolume Showcases High-Power Quantum Dot DFB Lasers in ELSFP Pluggable Module at Aperion Booth at OFC 2026 Innolume is pleased to announce the live demonstration of its high-power Quantum Dot (QD) DFB lasers integrated into an ELSFP pluggable module at the Aperion Technologies booth during OFC 2026, taking place at the Los Angeles Convention Center, California, USA. The jointly presented solution highlights a new generation of high-power optical engines for AI-driven datacenter interconnects, combining Innolume’s robust QD laser technology with Aperion’s ELSFP platform. The demonstration showcases how high optical output power, efficiency, and thermal stability can be achieved in a compact, OIF-compliant pluggable form factor. At the booth, visitors can experience a live demonstration of QD DFB lasers in the ELSFP module, delivering: ▪️ Ultra-high optical output power exceeding +23 dBm (200 mW). ▪️ Stable operation in the O-band. ▪️ Multi-wavelength capability (4 channels: 1301, 1311, 1321, and 1331 nm). ▪️ High efficiency (~15% power conversion efficiency at 55°C). ▪️ Near-athermal behavior in the temperature range of 35°C to 60°C (ΔPCE < 1%), enabling simplified thermal management. ▪️ Low relative intensity noise (RIN < –150 dB/Hz) and narrow intrinsic linewidth (< 10 kHz), supporting advanced modulation formats. Live measurements at the booth confirm optical output levels exceeding +23 dBm, demonstrating the scalability of the platform for next-generation high-power optical interconnects. The ELSFP module supports dual-ferrule configurations and is designed for emerging architectures such as Linear Pluggable Optics (LPO), Co-Packaged Optics (CPO), and Near-Packaged Optics (NPO), enabling higher link budgets and more energy-efficient system designs. We also warmly invite you to visit the Innolume booth #5239 to learn more about our semiconductor laser solutions and discuss your specific application requirements.

We’re now live at Laser World of Photonics China 2026 in Shanghai! Our team is already on-site and excited to welcome visitors throughout the exhibition. It’s great to see such strong interest and to reconnect with partners and new contacts from across the photonics industry. 📍 Visit us at Booth N5.5207 to discover our latest semiconductor laser solutions and optical amplifiers. Looking forward to meeting you in person over the next days!

The introduction of the XPO pluggable optics architecture by Arista Networks marks an important step for AI data center infrastructure. As part of this initiative, Innolume has joined the XPO Multi-Source Agreement (MSA) and looks forward to contributing to the next generation of optical interconnect technologies.

Innolume expands production facilities and prepares for installation of two new MBE6000 reactors Innolume is expanding its manufacturing platform to support the growing demand for advanced photonic devices. The expansion includes the development of new laboratory and production areas, as well as additional cleanroom facilities dedicated to epitaxial growth processes. The upgraded infrastructure will enable the fabrication of Quantum Dot photonic devices on 6-inch GaAs wafers, further strengthening Innolume’s path toward high-volume manufacturing of next-generation photonic components. Innolume’s current epitaxial production is based on two Riber MBE49 molecular beam epitaxy reactors, which are used for the growth of III–V semiconductor materials for optoelectronic devices and form the foundation of the company’s existing epitaxial manufacturing capacity. As part of the expansion, the company plans to install two Riber MBE6000 molecular beam epitaxy reactors, designed for large-scale epitaxial wafer production. The MBE6000 platform supports simultaneous growth on multiple 6-inch GaAs wafers per run, significantly increasing epitaxial throughput and enabling scalable manufacturing. Installation and commissioning of the new reactors are scheduled for Q4 2026. This investment represents a major step in scaling Innolume’s epitaxial manufacturing capacity and preparing the company for high-volume production of Quantum Dot photonic devices. The expansion is driven by rapidly growing demand for high-performance CW DFB lasers, single-mode lasers, high-power SOAs, WDM SOAs, and comb lasers based on Quantum Dot technology, across applications including optical interconnects for AI data centers and LiDAR systems. It will also support rapidly growing Innolume’s product portfolio based on GaAs quantum well devices. #MBE #Epitaxy #III_VSemiconductors #Innolume #Photonics

Innolume at Laser World of Photonics China 2026 Innolume will participate for the first time in Laser World of Photonics China 2026, taking place March 18-20, 2026 at the Shanghai New International Expo Centre. Visit us at Booth N5.5207 to discover our latest semiconductor laser solutions and optical amplifiers. At the exhibition we will showcase key technologies including: 🔹 Uncooled DFB Lasers - 70-500 mW output power depending on the form factor, low noise, and stable single-mode operation. 🔹 High-Power DFB Lasers - fiber-coupled lasers providing >300 mW output power in the 1270-1330 nm range with excellent spectral purity and low RIN. 🔹 High-Power BOA Amplifiers - optical amplifiers delivering >400 mW fiber output in the 1260-1310 nm range with broad bandwidth for signal boosting. Visitors can also learn more about our SOAs, SLDs, Gain Chips, Fabry-Perot Laser Diodes, FBGs, and Broad-Area Lasers. We look forward to meeting you at Booth N5.5207 to discuss your photonics projects. #Innolume #LaserWorldOfPhotonicsChina #Photonics #SemiconductorLasers #DFBLaser #OpticalAmplifiers #LaserTechnology #PhotonicsIndustry #LaserDiodes #ShanghaiExpo

𝐈𝐧𝐧𝐨𝐥𝐮𝐦𝐞 𝐏𝐫𝐞𝐬𝐞𝐧𝐭𝐚𝐭𝐢𝐨𝐧 𝐚𝐭 𝐭𝐡𝐞 𝐄𝐏𝐈𝐂 𝐓𝐞𝐜𝐡𝐧𝐨𝐥𝐨𝐠𝐲 𝐌𝐞𝐞𝐭𝐢𝐧𝐠 𝐨𝐧 𝐈𝐧𝐭𝐞𝐠𝐫𝐚𝐭𝐞𝐝 𝐏𝐡𝐨𝐭𝐨𝐧𝐢𝐜𝐬 𝐚𝐧𝐝 𝐏𝐚𝐜𝐤𝐚𝐠𝐢𝐧𝐠 𝐚𝐭 𝐏𝐇𝐈𝐗 On February 24-25, 2026, the EPIC Technology Meeting on Integrated Photonics and Packaging at PHIX took place in Enschede, the Netherlands. The event focused on photonic integrated circuits (PICs) and packaging technologies used in telecommunications, sensing systems, quantum technologies, and biomedical devices. During the Application Track: Datacenters and AI, Innolume R&D Engineer Alexey Borodkin gave a presentation titled: “High Power Laser Integration for Optical Interconnects and Ranging - Approaches and Tradeoffs.” The presentation covered recent development results related to quantum dot DFB lasers, SOAs, and laser integration. These developments were discussed as an important element for efficient integrated photonic systems. The integration developments are carried out in collaboration with PHIX and Demcon.