Fraunhofer ENAS

Two cities, one opportunity: Whether in Chemnitz or Regensburg – join us now and discover a place where your potential can thrive.   For our “Process, Device and Packaging Technologies” business unit, we are looking for the perfect addition to our team – both at our headquarters in Chemnitz and in Regensburg, where our "Innovation Office" is located. If you have a keen sense of what customers need, can strategically analyze markets, systematically build networks, and lead projects to success – then we should get to know each other. Experience in business development, technical expertise, and an entrepreneurial spirit, combined with strong negotiation skills and persuasive power, are also a real plus. Does this sound like you? If so, click here to learn more about our latest job opening as   𝗕𝘂𝘀𝗶𝗻𝗲𝘀𝘀 𝗗𝗲𝘃𝗲𝗹𝗼𝗽𝗺𝗲𝗻𝘁 & 𝗣𝗿𝗼𝗷𝗲𝗰𝘁 𝗠𝗮𝗻𝗮𝗴𝗲𝗿 𝗳𝗼𝗿 𝗦𝗲𝗺𝗶𝗰𝗼𝗻𝗱𝘂𝗰𝘁𝗼𝗿 𝗧𝗲𝗰𝗵𝗻𝗼𝗹𝗼𝗴𝗶𝗲𝘀 https://lnkd.in/grYeHX9a (German job posting)   If you want to make a difference alongside our team and are passionate about Germany's eastern and southern regions, don’t hesitate and send us your application today through our career portal.   We look forward to hearing from you!   #FraunhoferENAS #Hiring #Techjob #Careers #JoinOurTeam #ApplyToday ©Juergen Sack/Getty Images Signature/Canva, ©tupungato/Getty Images/Canva

Last week, we had the pleasure of hosting a very special 𝗖𝗵𝗲𝗺𝗻𝗶𝘁𝘇 𝗦𝗲𝗺𝗶𝗻𝗮𝗿  together with our guests, speakers, exhibitors and partners – filled with inspiring encounters, engaging conversations, and unforgettable insights.   With our spring seminar on the topic of “𝗘𝗹𝗲𝗰𝘁𝗿𝗼𝗻𝗶𝗰 𝗣𝗮𝗰𝗸𝗮𝗴𝗶𝗻𝗴 𝗮𝗻𝗱 𝗔𝗽𝗽𝗹𝗶𝗰𝗮𝘁𝗶𝗼𝗻𝘀”, we kicked off the event season and achieved fantastic results:   📊85 participants who enriched the event at Fraunhofer ENAS 📊17 speakers who provided exciting insights with their presentations 📊10 pitches in which innovative new ideas were presented 📊5 exhibition booths who made our seminar even more interesting 📊2 lab tours that provided a fascinating glimpse into our world of research.   All of our guests had one thing in common: curiosity, fascination, and a keen interest in the complexity of electronic packaging – whether in the field of additive, process or bonding technologies. During the seminar, we were able to take a look at the latest developments, discuss challenges, and learn about innovations that are driving the future of this industry.   We’d like to take you on a brief journey through the highlights of our first Chemnitz Seminar this year and look back together – enjoy swiping through some of our special moments in pictures.   Many thanks to everyone who made the two event days so special!   #ChemnitzSeminar #FraunhoferENAS #Bonding #ElectronicPackaging

Our colleague, Dr. Andreas Willert, recently received a great honor for his commitment to standardization: The members of the Technical Committee 119 (TC 119) of the IEC (International Electrotechnical Commission) presented him the “𝗔𝗽𝗽𝗿𝗲𝗰𝗶𝗮𝘁𝗶𝗼𝗻 𝗔𝘄𝗮𝗿𝗱” in recognition of his valuable contributions.   The TC 119 acts within IEC, the world’s leading organization for the development and publication of international standards for electrical engineering and electronics, and is specifically committed to advancing the standardization of printed electronics.   For several years, our colleague served as Chair, coordinating the activities of the IEC TC 119. The goal of the committee's work is to establish internationally valid standards in the field of printed electronics regarding the use of, for example, uniform materials, processes, or equipment. This helps to sustainably promote consistent quality, absolute reliability, and high levels of safety of new technologies, thereby strengthening confidence in innovative products.   With nearly 20 years of expertise in the field of printed electronics, our colleague brings not only in-depth know-how in this area but also a deep understanding of the industry, which he contributes to our daily research work alongside his standardization activities as deputy head of our “Printed Functionalities” department. In this field of research, we develop, for example, highly functional printed electronic components and assemblies that can be implemented in everyday electronics, such as in the form of conductive tracks, ultra-thin batteries, or highly sensitive sensors.   Together with you, Andreas, we are delighted about this wonderful award and the recognition of your impactful work on the committee in shaping new standards for cutting-edge electronics enabling pioneering technological progress.   #FraunhoferENAS #Electronics #PrintedFunctionalities #PrintedElectronics

Have you ever wondered how leading-edge innovations can help protect our water from invisible pollutants like hormone-like substances?   Then you should definitely mark 𝗠𝗮𝘆 𝟭𝟵, 𝟮𝟬𝟮𝟲, on your calendar.   The Greener Project, in which we, together with other partners, are working specifically on this challenge, is organizing a 𝘀𝘁𝗮𝗸𝗲𝗵𝗼𝗹𝗱𝗲𝗿 𝘄𝗼𝗿𝗸𝘀𝗵𝗼𝗽 in Rome, Italy, entitled “𝗔𝗱𝘃𝗮𝗻𝗰𝗶𝗻𝗴 𝗣𝗵𝗼𝘁𝗼𝗻𝗶𝗰 𝗦𝗼𝗹𝘂𝘁𝗶𝗼𝗻𝘀 𝗳𝗼𝗿 𝗘𝗻𝘃𝗶𝗿𝗼𝗻𝗺𝗲𝗻𝘁𝗮𝗹 𝗠𝗼𝗻𝗶𝘁𝗼𝗿𝗶𝗻𝗴” bringing together researchers, companies, institutional stakeholders, and project partners.   The event will highlight current project progress and feature a joint discussion on how 𝘀𝗶𝗻𝗴𝗹𝗲-𝗽𝗵𝗼𝘁𝗼𝗻 𝘀𝗼𝘂𝗿𝗰𝗲𝘀 𝗮𝗻𝗱 𝗱𝗲𝘁𝗲𝗰𝘁𝗼𝗿𝘀 integrated into a single-photon spectrometer offer the potential to detect even the smallest concentrations of hormone-like substances – so-called endocrine disruptors – in water. This will make a significant contribution to preserving our environment and protecting our health.   Our colleague Jörg Martin will also be on-site. In his presentation entitled “𝗢𝗻𝗲 𝗗𝗼𝘁, 𝗢𝗻𝗲 𝗣𝗵𝗼𝘁𝗼𝗻: 𝗖𝗼𝗹𝗹𝗼𝗶𝗱𝗮𝗹 𝗤𝘂𝗮𝗻𝘁𝘂𝗺 𝗗𝗼𝘁 𝗗𝗲𝘃𝗶𝗰𝗲𝘀 𝗳𝗼𝗿 𝗦𝗽𝗲𝗰𝘁𝗿𝗼𝘀𝗰𝗼𝗽𝘆 𝗮𝗻𝗱 𝗤𝘂𝗮𝗻𝘁𝘂𝗺 𝗧𝗲𝗰𝗵,” he will provide insights into our research work within the project.   Further details on the agenda and registration can be found here: 👇

When night turns into day and night owls wander curiously through Chemnitz and the evening, then it's time again for the 𝗟𝗼𝗻𝗴 𝗡𝗶𝗴𝗵𝘁 𝗼𝗳 𝗦𝗰𝗶𝗲𝗻𝗰𝗲.   On 𝗠𝗮𝘆 𝟵, 𝟮𝟬𝟮𝟲, explorers of all ages can embark on a journey of discovery as part of the Long Night of Science of Technische Universität Chemnitz and experience research and technology up close – to marvel, participate, and understand.   We are right in the middle of it too, offering an exciting glimpse into our 𝗘𝘂𝗿𝗼𝗽𝗲𝗮𝗻 𝗧𝗲𝘀𝘁 𝗮𝗻𝗱 𝗥𝗲𝗹𝗶𝗮𝗯𝗶𝗹𝗶𝘁𝘆 𝗖𝗲𝗻𝘁𝗲𝗿 (𝗘𝗧𝗥𝗖). In the presentation by our colleague Prof. Dr.-Ing. Daniel Kriesten, we’ll show why electronics sometimes get pretty hot.   Because to ensure that electronics always function safely and reliably, it must be intensively tested. At the ETRC, we conduct, for example, stress tests under various temperatures and climatic conditions that simulate the different environmental influences electronics will face in their future operating scenarios – whether in the freezing cold of Alaska or the scorching heat of the Sahara. This allows us to specifically determine whether electronic systems will function flawlessly for as long as intended, even under harsh conditions.   Ready for an exciting journey full of knowledge and the magic of research? Then mark our talk on your calendar now:   📅 Date: May 9, 2026 at 7 p.m. 📍 Location: C10.112 at University of Technology Chemnitz 🎙️ Title: The trial by fire of electronics: Why chips need to sweat before they work reliably   Come by and ask your questions – we look forward to seeing you!   #SaveTheDate #TUCtag26 #TUCtag #LongNightOfScience #FraunhoferENAS #ETRC #Testing #Reliability ©Maximusnd/Getty Images/Canva

🇵🇱 𝗪𝗶𝘁𝗮𝗺 𝗶 𝘀𝗲𝗿𝗱𝗲𝗰𝘇𝗻𝗲 𝗽𝗼𝘇𝗱𝗿𝗼𝘄𝗶𝗲𝗻𝗶𝗮 𝘇 𝗽𝗶ę𝗸𝗻𝗲𝗷 𝗪𝗮𝗿𝘀𝘇𝗮𝘄𝘆! (𝘏𝘦𝘭𝘭𝘰 𝘢𝘯𝘥 𝘸𝘢𝘳𝘮 𝘳𝘦𝘨𝘢𝘳𝘥𝘴 𝘧𝘳𝘰𝘮 𝘣𝘦𝘢𝘶𝘵𝘪𝘧𝘶𝘭 𝘞𝘢𝘳𝘴𝘢𝘸!)   Four presentations, one mission: to showcase our expertise – from precise material models to realistic simulations.   At last week´s 𝗜𝗻𝘁𝗲𝗿𝗻𝗮𝘁𝗶𝗼𝗻𝗮𝗹 𝗖𝗼𝗻𝗳𝗲𝗿𝗲𝗻𝗰𝗲 𝗼𝗻 𝗧𝗵𝗲𝗿𝗺𝗮𝗹, 𝗠𝗲𝗰𝗵𝗮𝗻𝗶𝗰𝗮𝗹 𝗮𝗻𝗱 𝗠𝘂𝗹𝘁𝗶𝗽𝗵𝘆𝘀𝗶𝗰𝘀 𝗦𝗶𝗺𝘂𝗹𝗮𝘁𝗶𝗼𝗻 𝗮𝗻𝗱 𝗘𝘅𝗽𝗲𝗿𝗶𝗺𝗲𝗻𝘁𝘀 𝗶𝗻 𝗠𝗶𝗰𝗿𝗼𝗲𝗹𝗲𝗰𝘁𝗿𝗼𝗻𝗶𝗰𝘀 𝗮𝗻𝗱 𝗠𝗶𝗰𝗿𝗼𝘀𝘆𝘀𝘁𝗲𝗺𝘀 (𝗘𝘂𝗿𝗼𝗦𝗶𝗺𝗘) in Warsaw, Poland, our colleagues Tobias Horn, Sounak Nandi, Sven Rzepka and Alexey Shaporin were able to demonstrate our expertise as Fraunhofer ENAS and show how modern electronics can become even more efficient and sustainable.   One of the key factors for increased reliability, stability, robustness, and performance of modern technologies is a holistically optimized functional, electrical, thermal and mechanical design. The combination of material modeling, reliability assessments of electronic components, the identification of weak points, and the prediction of product lifetimes provides the necessary information. Our team presented on-site how the institute can support customers along this path.   We greatly enjoyed sharing this know-how with the community and discussing the insights with the audience. See you next year, when EuroSimE takes place for the 28th time!   #FraunhoferENAS #Reliability #Simulation

🚀 Letzte Chance zur Anmeldung: Verpassen Sie nicht die Gelegenheit, sich Ihre Teilnahme am 𝗪𝗼𝗿𝗸𝘀𝗵𝗼𝗽 𝗠𝗘𝗠𝗦‑𝗧𝗲𝗰𝗵𝗻𝗼𝗹𝗼𝗴𝗶𝗲𝗻 & 𝗔𝗻𝘄𝗲𝗻𝗱𝘂𝗻𝗴𝗲𝗻 in Chemnitz zu sichern und exklusive Einblicke in die Zukunftstrends von morgen zu gewinnen.   Das Leistungszentrum »Funktionsintegration für die Mikro-/Nanoelektronik«, in welchem wir als Partner gemeinsam mit anderen Akteuren den Rhythmus neuer Innovationen bestimmen, freut sich schon jetzt darauf, sich mit Ihnen rund um das Thema MEMS auszutauschen, zu diskutieren und ins Gespräch zu kommen.   🗓️ Wann? 28. Mai 2026 📍 Wo? Fraunhofer ENAS in Chemnitz 🎯 Thema: MEMS-Technologien gezielt einsetzen: Von der Entwicklung bis zur industriellen Anwendung.   🔗 𝗠𝗲𝗵𝗿 𝗜𝗻𝗳𝗼𝘀 & 𝗔𝗻𝗺𝗲𝗹𝗱𝘂𝗻𝗴:  https://lnkd.in/dXWXe6bD   Anmeldungen sind noch bis zum 𝟭𝟭. 𝗠𝗮𝗶 𝟮𝟬𝟮𝟱 möglich. Seien Sie dabei – wir freuen uns auf Sie!   Mit: Fraunhofer IPMS I Fraunhofer IIS, Institutsteil Entwicklung Adaptiver Systeme I Fraunhofer IZM   #SaveTheDate #Event #Workshop #MEMS

Southeast Asia, here we come! We’ve traveled all around the world and are now ready to switch into trade show mode. Because today we’re right in the heart of vibrant Singapore, where the MTX - Milipol TechX Summit is currently taking place and will continue through April 30, 2026.   We’re also on site and looking forward to three exciting trade show days full of inspiration, new ideas, stimulating networking opportunities and exchanges, as well as pure industry energy.   At the Fraunhofer Singapore booth, where we are represented alongside our colleagues from Fraunhofer Heinrich Hertz Institute HHI and Fraunhofer Singapore, you can discover our latest developments, specifically in the management and monitoring of infrastructures:   You can experience, for example, how 𝘀𝗲𝗻𝘀𝗼𝗿-𝗯𝗮𝘀𝗲𝗱 𝘀𝘆𝘀𝘁𝗲𝗺𝘀 can be used to monitor power lines or cable joints, thereby ensuring greater safety – for instance, in the energy supply sector. Our 𝗠𝗘𝗠𝗦 𝗴𝘆𝗿𝗼𝘀𝗰𝗼𝗽𝗲𝘀 are also on site, which enable flawless and precise navigation of aircraft or underwater vehicles – completely independent of GPS and the Earth’s magnetic field. Last but not least, we’re showcasing our 𝘂𝗹𝘁𝗿𝗮𝘀𝗼𝗻𝗶𝗰 𝘁𝗿𝗮𝗻𝘀𝗱𝘂𝗰𝗲𝗿𝘀, which are particularly relevant for aerospace, road and rail mobility, the energy sector, or underwater infrastructure, as they enable precise and non-destructive testing and monitoring.   You can see these and many other exciting and innovative technological highlights at the 𝗙𝗿𝗮𝘂𝗻𝗵𝗼𝗳𝗲𝗿 𝗦𝗶𝗻𝗴𝗮𝗽𝗼𝗿𝗲 𝗯𝗼𝗼𝘁𝗵 𝗛𝗧𝗫 𝗦𝗰𝗶𝗲𝗻𝗰𝗲 𝗭𝗼𝗻𝗲 𝗟𝟭-𝟬𝟬𝟰.   Not enough yet?   Then be sure to attend the 𝗽𝗿𝗲𝘀𝗲𝗻𝘁𝗮𝘁𝗶𝗼𝗻 by our colleague Dr. Alexander Weiß:   📅 Date: April 29, 2026 at 1 p.m. 📍 Location: Lightning Talk@Science Zone Stage I HTX Science Zone (Level 1, Hall A) 🎤 Title: Protection of Power Grid Infrastructure with Smart Sensor Networks   Are you in Singapore as well? Then we should meet. Come by and let's talk.   ---   In the picture (from left to right): Our colleagues Dr. Alexander Weiß and Benedikt Mueller from Fraunhofer Singapur   #MTX2026 #MilipolTechX #FraunhoferENAS #MEMS #Sensors #Ultrasound

⏳Time is running out – our next 𝗖𝗵𝗲𝗺𝗻𝗶𝘁𝘇 𝗦𝗲𝗺𝗶𝗻𝗮𝗿 𝗼𝗻 “𝗘𝗹𝗲𝗰𝘁𝗿𝗼𝗻𝗶𝗰 𝗣𝗮𝗰𝗸𝗮𝗴𝗶𝗻𝗴 𝗮𝗻𝗱 𝗔𝗽𝗽𝗹𝗶𝗰𝗮𝘁𝗶𝗼𝗻𝘀” on 𝗠𝗮𝘆 𝟲 𝗮𝗻𝗱 𝟳, 𝟮𝟬𝟮𝟲 is getting closer, and the 𝗿𝗲𝗴𝗶𝘀𝘁𝗿𝗮𝘁𝗶𝗼𝗻 𝗱𝗲𝗮𝗱𝗹𝗶𝗻𝗲 on 𝗔𝗽𝗿𝗶𝗹 𝟮𝟴, 𝟮𝟬𝟮𝟲 is fast approaching. Want to join us? Now is the perfect time and the last chance to secure your spot. 𝗘𝘅𝗽𝗲𝗿𝗶𝗲𝗻𝗰𝗲 𝗮𝗹𝗹 𝗳𝗮𝗰𝗲𝘁𝘀 𝗼𝗳 𝗲𝗹𝗲𝗰𝘁𝗿𝗼𝗻𝗶𝗰 𝗽𝗮𝗰𝗸𝗮𝗴𝗶𝗻𝗴 Join industry experts, researchers, and technology leaders to delve deeply into the richness of the topic of electronic packaging in the sessions “Devices,” “Additive Technologies,” “Process Technologies,” and “Bonding Technologies,” gain fresh perspectives, and be inspired by new ideas. 𝗔 𝘀𝗽𝗲𝗰𝗶𝗮𝗹 𝗼𝗽𝗽𝗼𝗿𝘁𝘂𝗻𝗶𝘁𝘆 𝗳𝗼𝗿 𝘀𝘁𝘂𝗱𝗲𝗻𝘁𝘀 We offer students the unique opportunity to participate online in our Chemnitz Seminar to learn more about latest trends and developments in this field and gain valuable insights into the industry. 𝗝𝘂𝘀𝘁 𝗮 𝗳𝗲𝘄 𝗰𝗹𝗶𝗰𝗸𝘀 𝗮𝘄𝗮𝘆 𝗳𝗿𝗼𝗺 𝗿𝗲𝗴𝗶𝘀𝘁𝗲𝗿𝗶𝗻𝗴 Take your knowledge to the next level now, discover latest advancements, explore emerging challenges, and learn about groundbreaking innovations shaping the future of electronic packaging. Be part of our upcoming Chemnitz Seminar and register today: https://lnkd.in/dMNC-4r4 We are really looking forward to meeting you in Chemnitz and sharing thoughts and perspectives with you! #SaveTheDate #Event #ChemnitzSeminar #FraunhoferENAS #Bonding #ElectronicPackaging